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Autonomous Heat Pipe System for Electronic Components Thermostatting at Near-Earth Orbit Exploitation
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English
Abstract
The questions of the gas filled heat pipes' application for thermal control systems of scientific equipment are discussed. It is analyzed different extents of electronic components' integration:
- creating of thermal stability mounting places of devices; creating of cooled planes and surfaces on device's body;
- providing of thermal stability of internal components.
It is proposed design decisions providing of compensation some variable parameters such as device heat flows, external heat influences that are typical for near-earth orbits. Tests' results have shown the principal ability to construct schemes for thermal control of electronic components.
Authors
Citation
Baturkin, V., Zhuk, S., Savina, V., Khmelev, Y. et al., "Autonomous Heat Pipe System for Electronic Components Thermostatting at Near-Earth Orbit Exploitation," SAE Technical Paper 941302, 1994, https://doi.org/10.4271/941302.Also In
References
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