AMS2405D Electroless Nickel Plating Low Phosphorus

Purchase order shall specify not less than the following:

• AMS2405D
• Plating thickness desired
• Basis metal to be plated
• Tensile strength or hardness of the basis metal (steel alloys only)
• Pre-plate stress relief to be performed by plating processor (time and temperature) if different from 3.1.4.
• Special features, geometry or processing present on parts that require special attention by the processor
• Hydrogen embrittlement relief to be performed by plating processor if different from 3.3
• Post plating bake to be performed by plating processor (to harden plating on substrates capable of high temperature, or to improve adhesion) (See 3.3.3)
• Quantity of pieces to be plated

Parts manufacturing operations such as heat treating, forming, joining and media finishing can affect the condition of the substrate for plating, or if performed after plating, could adversely affect the plated part. The sequencing of these types of operations should be specified by the cognizant engineering organization or purchaser and is not controlled by this specification.