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High Conductance Thermal Interface Concept for Space Applications
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English
Abstract
An interface concept has been developed which produces high conductance at a thermal/mechanical joint without resorting to high clamping forces or potentially contaminating fillers such as thermal grease. This paper discusses the characteristics of several variations of the high conductance interface concept and compares them to those of existing interface concepts proposed for several Space Station applications. The application of the high conductance concept to thermal joints such as internal coldplate interfaces and external equipment module to heat acquisition plate interfaces would reduce the weight and complexity and increase the efficiency of the Space Station Thermal Management System.
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Authors
Citation
Poulin, E. and Horan, D., "High Conductance Thermal Interface Concept for Space Applications," SAE Technical Paper 911340, 1991, https://doi.org/10.4271/911340.Also In
References
- Spacelab Payload Accommodation Handbook slp/2104-3 Appendix C Environmental Control Interface Definition 2 28 February 1986
- Peterson, G.P. Starks G. Fletcher L.S. “Comparative Evaluation of Two Attachment Techniques for Space Station Cold Plates,” AIAA 24th Thermophysics Conference, Paper No. AIAA-89-1703 Buffalo, N.Y. June 12-14 1989
- Chambliss, J. Ewert M. “Modular, Thermal Bus-to-Radiator Integral Heat Exchanger Design for Space Station Freedom,” SAE Technical Paper 901435 , 20th Intersociety Conference on Environmental Systems Williamsburg, Virginia July 9-12 1990