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Tackling the Thermal Design Challenges of Smaller, Lighter, and More Efficient Avionics Systems
Technical Paper
2013-01-2165
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
Electronic systems play a key role in the high reliability and safety of modern aircrafts. Components have become smaller and faster leading to an increase in power density and making thermal management a more vital part of the overall design. This paper will demonstrate how thermal transient testing combined with computational fluid dynamics (CFD) can help balance these design constraints and ensure that critical devices will work safely within their prescribed temperature limits.
The first part of the paper will focus on the thermal characterization of a component using a continuous measurement method known as the static method per JEDEC51-1 standard. This data provides an insight of the overall component thermal performance and it can also be translated to structure function which helps with detecting potential internal thermal bottlenecks, such as a die attach material. This non-destructive technique can also be used to assess the performance of aging components and highlight any material degradation.
The second part of the paper will illustrate how a 1D thermal compact model can be generated from the thermal characterization and how it can be inserted into a thermal simulation of an avionics system. Adding such a model to a computational fluid dynamics analysis allows calculating an accurate junction and case temperature for the component without having to discreetly represent the geometrical part of the chip such as the die or the solder balls.
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Francois-Saint-Cyr, A., Marovic, B., and He, W., "Tackling the Thermal Design Challenges of Smaller, Lighter, and More Efficient Avionics Systems," SAE Technical Paper 2013-01-2165, 2013, https://doi.org/10.4271/2013-01-2165.Also In
References
- JEDEC Standard JESD51-1 Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device) http://www.jedec.org/standardsdocuments/docs/jesd-51-1 JEDEC Dec. 1995
- Szekely V. Identification of RC networks by deconvolution: Chances and Limits IEEE Trans. On Circuits and Systems - I: Fondamental Theory and Applications 45 3 244 258 1998
- NANOPACK Project http://www.nanopack.org/
- Rencz M. , Székely V. , Morelli A. , Villa C. Determining partial thermal resistances with transient measurements and using the method to detect die attach discontinuities 18th Annual IEEE SEMI-THERM Symposium March 1 14 2002 San Jose, CA, USA 15 20
- Poppe András , Molnár Gábor , Csuti Péter , Szabó Ferenc , Schanda János Ageing of LEDs: A comprehensive study based on the LM80 standard and thermal transient measurements CIE 27th Session-Proceedings, CIE 197:2011: (Volume 1, Part 1-2), Sun City, south Africa, 10/07/2011-15/07/2011 Vienna CIE 467 477 978 3 901906 99 2
- JEDEC Standard JESD51-14 Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-To-Case of Semiconductor Devices with Heat Flow through a Single Path http://www.jedec.org/standards-documents/results/JESD51-14 JEDEC Nov. 2010
- Ouyang Eric , Ahn Billy , Bornoff Robin , He Weikun , Islam Nokibul , Kim Gwang , Kim KyungOe , Vass-Varnai Andras Transient Thermal Characterization of fcBGA-H Device 29th Annual IEEE SEMI-THERM Symposium March 17 21 2013 San Jose, CA, USA
- Bornoff Robin , Vass-Varnai Andras A Detailed IC Package Numerical Model Calibration Methodology 29th Annual IEEE SEMI-THERM Symposium March 17 21 2013 San Jose, CA, USA