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Design and Analysis of Sigma Z-Source Inverter for PV Applications

SRM Institute Of Science And Technology-Kalaiarasi Nallathambi, Uthra Rangarajan, Anitha Daniel
Published 2019-10-11 by SAE International in United States
Traditional Voltage Source Inverter (VSI) produces lesser output voltage than the input and causes shoot-through due to the gating of the semiconductor device connected in same leg. The ZSI is used to overcome the inadequacies of VSI. The ZSI has been extensively used in electric drives, PV system and UPS. The conventional ZSI suffers some disadvantages like restricted boost capability, discontinuity in input current and large inrush current. These limitations are overcome by using a transformer which replaces the inductor in the impedance source network. In high-voltage gain applications, the single transformer-based ZSI topologies requires more turns ratio which requires large size transformer. For improving the boost capability, the TZSI is used. The Z-source network of the TZSI constitutes two transformers with low turns ratio. TZSI has certain demerits such as restricted boost capability, high inrush current and discontinuity in the input current. However, TZSI requires high turns ratio to increase the boost capability. Thus, the modified ZSI, i.e. sigma ZSI is investigated in this paper. The sigma ZSI has the advantage of having reduced…
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Double-Sided Si(Ge)/Sapphire/III-Nitride Hybrid Structures

  • Magazine Article
  • TBMG-34888
Published 2019-08-01 by Tech Briefs Media Group in United States

NASA Langley Research Center has developed a double-sided Si(Ge)/ Sapphire/III-Nitride hybrid structure. This technology uses both sides of a sapphire wafer to build device structures — on one side, making either Si or SiGe devices and on the other side, making III-Nitride device structures (e.g. GaN, InGaN, AlGaN).

Visualizing Motion of Water Molecules for Liquid-Based Electronics

  • Magazine Article
  • TBMG-34892
Published 2019-08-01 by Tech Briefs Media Group in United States

A high-resolution inelastic x-ray scattering technique was used to measure the strong bond involving a hydrogen atom sandwiched between two oxygen atoms. This hydrogen bond is a quantum-mechanical phenomenon responsible for various properties of water, including viscosity, that determine a liquid's resistance to flow or to change shape.

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Requirements for Plastic Encapsulated Discrete Semiconductors in Military and Avionics Applications

CE-12 Solid State Devices
  • Aerospace Standard
  • AS6294/4
  • Current
Published 2019-07-09 by SAE International in United States
This standard documents and establishes common industry practices, and screening and qualification testing, of plastic encapsulated discrete semiconductors (PEDs) for use in military and avionics application environments.
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LED Signal and Marking Lighting Devices

Signaling and Marking Devices Stds Comm
  • Ground Vehicle Standard
  • J1889_201907
  • Current
Published 2019-07-01 by SAE International in United States
This SAE Recommended Practice applies to functions of motor vehicle signaling and marking lighting devices which use light emitting diodes (LEDs) as light sources. This report provides test methods, requirements, and guidelines applicable to the special characteristics of LED lighting devices. This Recommended Practice is in addition to those required for devices designed with incandescent light sources. This report is intended to be a guide to standard practice and is subject to change to reflect additional experience and technical advances.
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Graphene-Silicon Devices for Optoelectronics Applications

  • Magazine Article
  • TBMG-34628
Published 2019-06-01 by Tech Briefs Media Group in United States

Silicon is a naturally occurring material commonly used as a semiconductor in electronic devices; however, researchers have exhausted the potential of devices with semiconductors made of silicon only. These devices are limited by silicon’s carrier mobility — the speed at which a charge moves through the material — and indirect bandgap, which limits its ability to release and absorb light.

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Standardized Symbols for Electrical Circuit Diagrams

Truck and Bus Electrical Systems Committee
  • Ground Vehicle Standard
  • J2221_201905
  • Current
Published 2019-05-16 by SAE International in United States
This SAE Recommended Practice identifies graphic symbols used in electrical circuit diagrams. The symbols aid troubleshooting electrical systems.
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Process for Assessment and Mitigation of Early Wearout of Life-Limited Microcircuits

APMC Avionics Process Management
  • Aerospace Standard
  • ARP6338A
  • Current
Published 2019-02-08 by SAE International in United States
This document is intended for use by designers, reliability engineers, and others associated with the design, production, and support of electronic sub-assemblies, assemblies, and equipment used in AADHP applications to conduct lifetime assessments of microcircuits with the potential for early wearout; and to implement mitigations when required; and by the users of the AADHP equipment to assess those designs and mitigations. This document focuses on the LLM wearout assessment process. It acknowledges that the AADHP system design process also includes related risk mitigation and management; however, this document includes only high-level reference and discussion of those topics, in order to show their relationship to the LLM assessment process.
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Aircraft Cabin Illumination

A-20C Interior Lighting
  • Aerospace Standard
  • AIR512G
  • Current
Published 2018-11-05 by SAE International in United States
This document covers the general recommendations for cabin lighting in order to provide satisfactory illumination for, but not limited to, commercial transport aircraft: a Boarding and deplaning b Movement about the cabin c Reading d Use of lavatories e Use of work areas f Using stowage compartments, coat rooms, and closets g Using interior stairways and elevators (lifts) h Use of crew rest areas
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Transient Stability Analysis of DC Solid State Power Controller (SSPC) for More Electric Aircraft

JiaWei Zhang
University of Nottingham-Jeevan Adhikari, Tao Yang, Mohamed Rashed, Serhiy Bozhko, Patrick W. Wheeler
Published 2018-10-30 by SAE International in United States
The solid state power controller (SSPC) is one of the most important power electronic components of the aircraft electrical power distribution (EPS) systems. This paper presents an architecture of the DC SSPC and provides the mitigation techniques for transient voltage overshoot during its turn-off. The high source side inductance carries breaking current (9xnominal current) just before turnoff and induces large voltage transient across the semiconductor devices. Therefore, the stored inductive energy needs to be dissipated in order to prevent semiconductor switches from over-voltage/thermal breakdown. Three different transient voltage suppression (TVS) devices to reduce voltage stress across switches are included in the paper for detail study. The comprehensive comparison of the TVS devices is presented. In addition, the thermal impact of the TVS devices on the semiconductor switches is also analyzed. Later, the transient simulation model of the SSPC is built in LT-Spice and the effectiveness of the proposed protection mechanisms is verified.
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