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G-24 Pb-free Risk Management Committee for ADHP
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Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder

G-24 Pb-free Risk Management Committee for ADHP
  • Aerospace Standard
  • ARP6415
  • Current
Published 2019-07-23 by SAE International in United States

This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.

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Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts

G-24 Pb-free Risk Management Committee for ADHP
  • Aerospace Standard
  • GEIASTD0006B
  • Current
Published 2019-04-01 by SAE International in United States
This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by a robotic hot solder dip service supplier or production facilities at the customer, whenever the intent of the dipping is to have full coverage and replacement of Pb-free tin. Replacement of BGA spheres or CGA columns…
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Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes

G-24 Pb-free Risk Management Committee for ADHP
  • Aerospace Standard
  • GEIASTD0005_3A
  • Current
Published 2018-02-12 by SAE International in United States
This document defines: 1 A default method for those companies that require a pre-defined approach and 2 A protocol for those companies that wish to develop their own test methods. The default method (Section 4 of the document) is intended for use by electronic equipment manufacturers, repair facilities, or programs which, for a variety of reasons, may be unable to develop methods specific to their own products and applications. It is to be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing Pb-free solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of AHP electronic equipment. The protocol (Section 5 of the document) is intended for use by manufacturers or repair facilities which have the necessary resources to design and conduct reliability, qualification, or process development tests that are specific to their products, their operating conditions, and their applications. Users of the protocol will have the necessary knowledge, experience,…
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Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and Finishes

G-24 Pb-free Risk Management Committee for ADHP
  • Aerospace Standard
  • GEIAHB0005_2
  • Current
Published 2016-06-17 by SAE International in United States
This document is intended for use as technical guidance by Aerospace system suppliers, e.g., Aerospace system Original Equipment Manufacturers (OEMs) and Aerospace system maintenance facilities, in developing and implementing designs and processes to assure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as AHP) both during and after the transition to Pb-Free electronics. This document is intended for application to aerospace products; however, it may also be applied, at the discretion of the user, to other products with similar characteristics, e.g., low-volume, rugged use environments, high reliability, long lifetime, and reparability. If other industries wish to use this document, they may substitute the name of their industry for the word “Aerospace” in this document. The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to assure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with Document GEIA-STD-0005-1, “Performance Standard for High Performance Electronic Systems Containing Pb-Free Solder.” This document also contains…
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Program Management/Systems Engineering Guidelines for Managing the Transition to Lead-Free Electronics

G-24 Pb-free Risk Management Committee for ADHP
  • Aerospace Standard
  • GEIAHB0005_1A
  • Current
Published 2016-02-24 by SAE International in United States
This handbook is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with GEIA-STD-0005-1, “Performance Standard for Aerospace and High Performance Electronic Systems Containing Pb-free Solder”. Please note that the program manager, and managers of systems engineering, Supply Chain and Quality Assurance (along with their respective organizations), and the appropriate enterprise authority need to work together in ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated accordingly. Herein “program management (or manager), supplier chain management (or manager), quality assurance management (or manager) and systems engineering management (or manager) and/or the appropriate enterprise authority” shall be defined as “responsible manager” throughout the remaining document (see Section 3, Terms and Definitions). The basic principles delineated in this handbook can be used for program management, system engineering, supply chain management and quality assurance management of any aerospace and/or high performance program. Appendix A contains a General Responsible Manager Checklist for Dealing with Pb-free Issues. The checklist can be used to identify potential issues related to…
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Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts

G-24 Pb-free Risk Management Committee for ADHP
  • Aerospace Standard
  • GEIASTD0006A
  • Historical
Published 2016-02-24 by SAE International in United States
This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by a robotic hot solder dip service supplier or production facilities at the customer, whenever the intent of the dipping is to have full coverage and replacement of Pb-free tin. Replacement of BGA spheres or CGA columns…
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Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems

G-24 Pb-free Risk Management Committee for ADHP
  • Aerospace Standard
  • GEIAHB0005_3
  • Current
Published 2015-09-17 by SAE International in United States
This document provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task. This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “Rework/Repair” is used as applicable. NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.
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Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems

G-24 Pb-free Risk Management Committee for ADHP
  • Aerospace Standard
  • GEIASTD0005_2A
  • Current
Published 2012-05-01 by SAE International in United States
This Standard establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin finishes in electronic systems. This Standard is applicable to Aerospace, Defense, and High Performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.
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Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder

G-24 Pb-free Risk Management Committee for ADHP
  • Aerospace Standard
  • GEIASTD0005_1A
  • Current
Published 2012-03-01 by SAE International in United States
This standard defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. It is intended to communicate requirements for a Pb-free Control Plan (LFCP), hereinafter referred to as the Plan, and to assist the Plan Owners in the development of their own Plans. The Plan documents the Plan Owner’s processes that assure their customers, and all other stakeholders that the Plan Owner’s products will continue to meet their requirements, given the risks stated in the Introduction. This standard does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the ADHP industries that must be addressed by the processes. Pb-free risk management should be accomplished through specific requirements added to the Plan Owner’s existing infrastructure of product management and control. This standard applies to the ADHP electronics system supply…
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Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts

G-24 Pb-free Risk Management Committee for ADHP
  • Aerospace Standard
  • GEIASTD0006
  • Historical
Published 2008-07-01 by SAE International in United States
This standard defines the requirements for fully replacing undesirable surface finishes using solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic and semi-automatic dipping process but does not cover purely manual dipping processes, due to the lack of understanding of the appropriate requirements for hand-dipping for tin whisker mitigation at this time. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by any other group, including a third party supplier, production facilities at the supplier and other organizations, whenever the intent of the dipping is to have full coverage and…
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