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Transient Liquid Phase Sintering (TLPS) Conductive Adhesives for High Temperature Automotive Applications

SAE International Journal of Materials and Manufacturing

  • Journal Article
  • 2014-01-0797
Published 2014-04-01 by SAE International in United States
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Enhanced Imager Chip Packaging for Automotive Applications

Published 2005-04-11 by SAE International in United States
Annotation ability available