Undercooled Metal Technology for Flexible Electronics

  • Magazine Article
  • TBMG-35427
Published November 01, 2019 by Tech Briefs Media Group in United States
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  • English

Undercooled metal technology was developed that features liquid metal (in this case, Field's metal, an alloy of bismuth, indium, and tin) trapped below its melting point in polished, oxide shells, creating particles about 10-millionths of a meter across. When the shells are broken — with mechanical pressure or chemical dissolving — the metal inside flows and solidifies, creating a heat-free weld or, in this case, printing conductive, metallic lines and traces on all kinds of materials, from a concrete wall to a leaf.