Silicon Heat Pipe Array

  • Magazine Article
  • TBMG-15662
Published February 01, 2013 by Tech Briefs Media Group in United States
Language:
  • English

Improved methods of heat dissipation are required for modern, high-powerdensity electronic systems. As increased functionality is progressively compacted into decreasing volumes, this need will be exacerbated. High-performance chip power is predicted to increase monotonically and rapidly with time. Systems utilizing these chips are currently reliant upon decades of old cooling technology.