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Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, High HDT
- Aerospace Material Specification
Published September 22, 2016 by SAE International in United States
This specification covers an epoxy resin formulation supplied as a two-component system, requiring an oven cure for attainment of maximum properties.
Cancel due to inaccurate technical requirements.
|Aerospace Material Specification||Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure|
|Aerospace Material Specification||Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant|
|Aerospace Material Specification||Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Machinable|
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