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Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure
- Aerospace Material Specification
Published September 22, 2016 by SAE International in United States
This specification covers a unfilled, room-temeperature-polymerizing epoxy resin formulation, supplied as a two-component system.
Cancel due to inaccurate technical requirements.
|Aerospace Material Specification||Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant|
|Aerospace Material Specification||Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Machinable|
|Aerospace Material Specification||Potting Compound, Epoxy Bisphenol A-Type Impregnating Resin, Heat Cure, Single Component|
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