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ADHESIVE, POLYIMIDE RESIN, FILM AND PASTE High Temperature Resistant, 315°C or 600°F
- Aerospace Material Specification
- AMS3686
- Issued
Downloadable datasets available
Annotation ability available
Sector:
Issuing Committee:
Language:
English
Scope
This specification covers a high-temperature, electrical-grade, polyimide resin adhesive in the form of film or paste.
Topic
Data Sets - Support Documents
| Title | Description | Download |
|---|---|---|
| Unnamed Dataset 1 | ||
| TABLE I | Mechanical Properties of Bonded Joints | |
| TABLE I | (SI) Mechanical Properties of Bonded Joints |
Issuing Committee
AMS P Polymeric Materials Committee
Welcome to the AMS-P Polymeric & Composites Materials Committee discussion forum.
The AMS-P Polymeric Materials Committee writes and revises Aerospace Material Specifications (AMS), Metric Aerospace Materials Specifications (MAM), Aerospace Recommended Practices (ARP), and Aerospace Information Reports (AIR) for composite material technology as assigned to the committee. No copyrighted material may be posted in this forum. SAE is not liable for opinions expressed or information posted to this forum. All information posted becomes the property of SAE.Reference
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