This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Next Generation Hemflange Adhesive
Annotation ability available
Sector:
Language:
English
Abstract
As component sheet metals become thinner and surface properties prove to be more dynamic than ever, conventional induction heat catalyzed adhesives must evolve to perform under increasingly restrictive parameters. Thin metal distortion at typical induction cure temperatures, coupled with shelf life restrictions that seem to be inherent with most commercially available one component adhesive systems, has forced the need for a “Next Generation” hem adhesive. This presentation focuses on the recent development of a one component induction heat responsive structural adhesive which meets the critical requirements of the automobile manufacturing arena of the future. This adhesive system shows impressive results in low-temperature induction cure scenarios and has been capable of maintaining exceptional adhesion characteristics on numerous substrates.
Recommended Content
Aerospace Material Specification | Sealing Compound, Polythioether Nonchromated, Corrosion Inhibiting for Intermittent Use to 360°F (182°C) |
Aerospace Material Specification | Putty, General Purpose, Non-Hardening, Corrosion-Inhibiting |
Aerospace Material Specification | Sealing Compound, Integral Fuel Tanks and General Purpose, Intermittent Use to 360 °F (182 °C) |
Authors
Topic
Citation
Ferguson, T., Shah, P., and Scott, T., "Next Generation Hemflange Adhesive," SAE Technical Paper 980462, 1998, https://doi.org/10.4271/980462.Also In
References
- Induction Heating SOLID STATE TECHNOLOGY October 1969 41 44
- Induction Heating SOLID STATE TECHNOLOGY October 1969 41 44
- Weast, Robert C. Ph.D. CRC Handbook of Chemistry and Physics Boca Raton CRC PRESS, Inc. 1980 E-86
- Wiseman Donald Induction Technology Manager MILLER Electric Manufacturing Company Appleton, Wisconsin
- Weast, Robert C. Ph.D. CRC Handbook of Chemistry and Physics Boca Raton CRC PRESS, Inc. 1980 E-123