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PBGA Reliability Study for Automotive Applications
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English
Abstract
Plastic Ball Grid Array (PBGA) packages have been used in many applications. Most studies designed to verify solder joint reliability and package integrity have focused on commercial applications (Temperature Cycling range 0°C to 100°C). Other studies have shown that this package design will not meet the requirements for automotive applications.1 Design enhancements aimed at making the PBGA more robust and capable of being used in automotive application have been suggested. A joint effort by Chrysler, Delco Electronics, Ford Visteon Automotive Systems, and Motorola Semiconductor was organized to design and test PBGA packages for automotive applications and to develop module assembly processes for PBGA packages.
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Citation
Adams, R., Glovatsky, A., Lindley, T., Evans, J. et al., "PBGA Reliability Study for Automotive Applications," SAE Technical Paper 980341, 1998, https://doi.org/10.4271/980341.Also In
References
- Lindley, Theresa BGA Solder Joint Reliability Study for Automotive Electronics Delco Electronics Kokomo, IN 46904
- Lau, J.H. Pao Y.-H. Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies MCGraw-Hill New York, NY 1997
- Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
- Abernethy R. Weibull Analysis Handbook October 1995
- Darveaux R. Mawer A. Thermal and Power Cycling Limits of PBGA Assemblies 1995 Surface Mount International Proceedings 315 326