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Lead Free Solder for Vehicle Electronics
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English
Abstract
Several lead-free alloys have been studied for potential use in electronics by the National Center for Manufacturing Sciences(NCMS) Lead Free Solder Consortium that ended in 1996. Since then, one of these alloys has been studied using an existing product in order to determine the viability of Lead Free Vehicle Electronics. Design, supply chain, manufacturability, and reliability data for the electronics components and system are a part of this paper.
Authors
Citation
Whitten, G., "Lead Free Solder for Vehicle Electronics," SAE Technical Paper 973210, 1997, https://doi.org/10.4271/973210.Also In
References
- “Lead Free Solder Project Final Report” NCMS Report 0401RE96 1997 National Center for Manufacturing Sciences 3025 Boardwalk, Ann Arbor Michigan 48108-3266
- Wu T.Y. et al “Thermo-mechanical strain characterization for printed wiring boards” IBM J. Res. Develop. 37 5 September 1993