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Ceramic Circuit Technologies for Automotive Electronics Applications
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English
Abstract
Examples of ceramic circuits, mainly advanced electronic controller systems, designed to meet the needs of highly-integrated engine and vehicle control applications are presented. The elements of a strategy designed to meet the challenges presented by future integration requirements are discussed. Brief descriptions of the contributing technologies, plus an assessment of their current and projected capabilities are included. A road map for the development of this advanced ceramic thick film technology is presented.
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Citation
Sarma, D., Stankavich, A., and Needes, C., "Ceramic Circuit Technologies for Automotive Electronics Applications," SAE Technical Paper 962201, 1996, https://doi.org/10.4271/962201.Also In
References
- Sarma D.H.R. Richter F.E. McDermott M.G. Needes C.R.S. McCormick C.J. Anderson D.K. “Material System for a Hybrid Anti-lock Brake Circuit” Proceedings 10th European Microelectronics Conference Copenhagen 568 572 1995
- LaBranche M.H. McCormick C.J. Smith J.D. Needes C.R.S. Hang K.W. Isenberg J.K. Schubring A.W. Coapman C.R. Paszkeit C.A. Lautzenhiser F.P. Sarma D.H.R. “Next Generation Engine Control Modules Using Advanced Multi-layer Technology Materials,” ISHM Proceedings 1996
- Bender D.K. Ferreira A.M. “Higher Density using Diffusion Patterned Vias and Fine-line printing,” ISHM Proceedings 494 499 1993
- Loewe H.D. Kaindl M. “Breakthrough in Multichip Modules: Thick film Technology with Diffusion Patterning Vias,” Components XXIX 3 26 29 1994
- Needes C.R.S. Mason R.C. Fahey M.A. “Diffusion Patterning - A “Smart” Technology,” Proceedings IMC 1996
- Cazenave J.P. Suess T.R. “Fodel ™ Photo-imageable Materials - A thick film solution for High-Density Multichip Modules” ISHM Proceedings 483 488 1993