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Thermal Physics of Failure
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English
Abstract
Temperature changes cause thermo-mechanical stresses and creep in solder joints of electronics. These conditions induce cracking in the solder and eventual failure of the electronic component. This paper describes procedures for predicting the lifetime to failure of electronics exposed to thermal cycling.
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Authors
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Citation
Perez, R., "Thermal Physics of Failure," SAE Technical Paper 961266, 1996, https://doi.org/10.4271/961266.Also In
References
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