This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Metal Microchannel Coolers for High Heat Flux Applications
Annotation ability available
Sector:
Language:
English
Abstract
Theoretical comparisons of the performances of copper and silicon microchannel coolers are presented. The fabrication and testing of copper microchannel coolers with microchannel passage widths of 32 μm and 63.5 μm is described. Both a straight channel and a jet impingement design were built. The thermal performance of the copper coolers is shown to be slightly higher than that of comparable silicon coolers at greatly reduced pumping powers. The jet impingement design is shown to perform better than the straight channel design.
Recommended Content
Authors
Topic
Citation
Campbell, G., Sherman, M., Estes, E., and Hassapis, C., "Metal Microchannel Coolers for High Heat Flux Applications," SAE Technical Paper 951442, 1995, https://doi.org/10.4271/951442.Also In
References
- Tuckerman D. B. Pease R. F. W. “High-performance heat sinking for VLSI,” IEEE Electron Device Letters, EDL-2 126 129 1981
- Tuckerman D. B. “Heat-transfer microstructures for integrated circuits,” Stanford University 1984
- Goodling J. S. “Microchannel heat exchangers - a review,” 1997 Paper No. 1997-06 High Heat Flux Engineering II 12-13 July 1993
- Goodling J. S. Knight R. W. “Optimal design of heat sinks: a review,” Optimal Design of Thermal Systems and Components 279 6th AIAA/ASME Thermophysics and Heat Transfer Conference Colorado Springs, CO 20 - 23 June 1994
- Campbell G. O. “Semiconductor Laser Array Cooler Development,” Final Technical Report, Contract F29601- 93-C-0039, SA9401-07 10 June 1994
- Bland T. J. et al. “A compact high intensity cooler (CHIC),” SAE No. 831127 13th Intersociety Conf. on Environmental Systems San Francisco, CA 11-13 July 1983
- Grote M. G. et al. “Test results of wafer thin coolers at heat fluxes from 5 to 125 W/cm 2 ,” SAE No. 880997 18th Intersociety Conf. on Environmental Systems San Francisco, CA 11 - 13 July 1988
- Flynn E. M Mackowski M. J. “High Flux Heat Exchanger,” WL-TR-93-2027, Interim Report, Contract F33615-90-C-2054 January 1993
- Downing R. S. et al. “A high flux heat exchanger for military avionics. Part I: Design and fabrication,” SAE No. 941180 Aerospace Atlantic Dayton, OH 18-22 April 1994
- Flynn E. M. et al. “A high flux heat exchanger for military avionics. Part II: Test results,” SAE 941186 Aerospace Atlantic Dayton, OH 18-22 April 1994
- Phelps J. D. et al. “Microchannel heat exchanger design for hypersonic engine actively cooled structures,” Paper #175 from the Ninth NASP Technology Symposium Nov. 1-2 1990
- Phillips R. J. “Forced-Convection, Liquid-Cooled Microchannel Heat Sinks,” AD-A193-337, MIT/LL Technical Report 787 7 January 1988
- Sherman M. M. Campbell G. O. “State-of-the-Art Microchannel Designs and Design Optimization Techniques,” 1st Spacecraft Thermal Management Symposium Albuquerque, NM 15-17 November 1994
- Beach R. et al. “Modular microchannel cooled heatsinks for high average power laser diode arrays,” IEEE Journal of Quantum Electronics 28 4 966 976 April 1992
- Beach R. et al “High-reliability silicon microchannel submount for high average power laser diode arrays,” Appl. Phys. Lett. 56 21 2065 2067 21 May 1990