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Ultra-High Thermal Conductivity Substrate for Electronic Components
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English
Abstract
The development of chemically vapor deposited (CVD) diamond promises to greatly impact numerous technologies, and in particular the field of thermal management. Despite its current high cost, the physical properties of CVD diamond are so attractive, compared to currently implemented materials, that its use is justified in a few demanding or previously impossible applications. Unfortunately, at $50 or more per carat, the cost/performance ratio is well beyond the limits that would make it useful for many more widely spread applications. This paper describes an affordable variant of CVD diamond that is under development for thermal management in electronics. This material, designated “diamond/carbon/carbon composite,” consists of a carbon/carbon composite that is partially infiltrated with CVD diamond in the surface region. The performance advantages of DCC relative to current thermal management materials are analyzed, and the cost advantages relative to pure CVD diamond are discussed.
Authors
Citation
Lake, M., Ting, J., Jacobsen, R., Lagounov, A. et al., "Ultra-High Thermal Conductivity Substrate for Electronic Components," SAE Technical Paper 942186, 1994, https://doi.org/10.4271/942186.Also In
References
- Kokado M. Yoshida M. Miyoshi N. Suzuki K. Takaika M. Tsuzuki N. Harada H. IEEE J. of Solid State Circuits 24 5 1989 1271
- Goyal A. Jaeger R.C. Bhavani S.H. Ellis C.D. Phadke N.K. Azimi-Rashti M. Golding J.S. Proc. Semi-Therm 1992 Austin, TX February 1992 25
- Busch J.V Dismukes J.P. Diamond and Related Materials 3 1994 295
- Brown A. “Diamonds are Technology's Best Friend,” Aerospace America February 1991 26
- Anthony T.R. Banholzer W.F. Fleischer J.F. Wei L. Kuo P.K. Thomas R.L. Pryor R.W. Phys. Rev. B 42 1990 1104
- Ting J.-M. Lake M.L.
- Lake M.L. Ting J.-M. Gottschlich J.M. “Diamond/Carbon/Carbon Composite Coldplates for Aerospace Thermal Management,” SAE Technical Paper Series Number 94118 Aerospace Atlantic Conference and Exposition Dayton, OH April 18-22 1994
- Ting J.-M. Lake M.L. Ingram D.C. Diamond and Related Materials 2 5-7 1993 1069
- Tibbetts G.G. “Vapor-Grown Carbon Fibers,” Carbon Fibers, Filaments, and Composites Figueiredo J.C. et al. Kluwer Academic Publishers 1990 Netherlands 73
- Ting J.-M. Lake M.L.
- p-Type MOS Controlled Thyristor Harris Semiconductor
- Sussmann R.S. Brandon J.R. Scarsbrook G. A. Sweeney C.G. Valentine T.J. Whitehead A.J. Wort C.J.H. Diamond and Related Materials 3 1994 303
- The Properties of Diamond Field J.E. Academic Press 1979 New York
- Tachibana T. Williams B.E. Glass J.T. Phys. Rev. B 45 1992 11975
- Graebner J.E. Jin S. Kammlott G.W. Herb J.A. Gardinier C.F. Nature 359 1992 401
- Graebner J.E. Jin S. Kammlott G.W. Wong Y.-H. Herb J.A. Gardinier C.F. Diamond and Related Materials 2 1993 1059