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Thermal Design of a High-Power C-Band Phased Array With Integral MMIC Amplifiers
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Abstract
The thermal design of a high-power C-band phased array with integral solid-state amplifiers, and its integration into a three-axis-stabilized spacecraft, are discussed. A thermal design has been developed employing fixed-conductance heat pipes and an embedded heat pipe radiator panel. The design tradeoffs and problems encountered in removing 2,000 W from a 1-m-diameter array are described, and possible solutions are presented. The highly concentrated heat source associated with solid-state amplifiers has emphasized the importance of minimizing MMIC chip internal thermal resistance in terms of the overall thermal control subsystem weight. Thermal test verification issues and concerns with 1-g operation in integrated spacecraft testing are also addressed.
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Authors
Citation
Kelly, W., Albright, G., Yogev, I., and Zaharovits, M., "Thermal Design of a High-Power C-Band Phased Array With Integral MMIC Amplifiers," SAE Technical Paper 941552, 1994, https://doi.org/10.4271/941552.Also In
References
- Phelps L. et al. “Development and Production of Linearized C-Band SSPAs for Multibeam Satellite Communications Systems,” AIAA 15th International Communications Satellite Systems Conference San Diego, California February March 1994 A Collection of Technical Papers 334 343 AIAA Paper No. 94-0951 -CP
- Estep G. et al. “A Modular Beam-Forming Matrix for Active Phased-Array Antennas,” 15th AIAA International Communications Satellite Systems Conference San Diego, California February March 1994 A Collection of Technical Papers 323 327 AIAA Paper No. 94-0896-CP
- Wolfe D. Dynatherm Corporation
- Kelly W. H. Reisenweber J. H. “Thermal Performance of Embedded Heat Pipe Spacecraft Radiator Panels,” SAE 23rd International Conference on Environmental Systems Colorado Springs, Colorado SAE Technical Paper No. 932158