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Silicon Microstructures: Merging Mechanics with Electronics
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Abstract
We review the advantages of silicon micromachining in manufacturing low-cost, high-volume, mechanical sensors. The characteristics of the technology are discussed and contrasted with those of typical milling operations. We describe the fabrication of simple mechanical elements to explain how micromachined parts can be manufactured in large numbers with a high degree of dimensional control. These parts are the key components of cost-effective, high performance pressure, flow, and acceleration sensors that are gradually penetrating the automotive market.
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Zanini, M. and Stevenson, P., "Silicon Microstructures: Merging Mechanics with Electronics," SAE Technical Paper 920472, 1992, https://doi.org/10.4271/920472.Also In
References
- Grace R. H. “Semiconductor Sensors and Microstructures in Automotive Applications” SAE No. 910495
- Middelhoek S. Hoogerwerf A. C. “Smart Sensors: When and Where?” Sensors and Actuators 8 39 1985
- Petersen K. E. “Silicon as a Mechanical Material” Proc. IEEE 70 420 1982
- Pearson G. L. Reed, W. T. Jr Feldman W. L. “Deformation and Fracture of Small Silicon Crystals” Acta Metallurgica 5 181 1957
- Bean K. E. “Anisotropic etching of silicon” IEEE Trans. Electron Devices ED-25 1185 1978
- Zanini M. Mikkor M. Elder R. C. Cathey L. W. Bomback J. L. Artz B. E. “Edge Erosion Effects in Double Sided Silicon Micromachining” IEEE Solid State Sensors and Actuator Workshop Hilton Head, SC June 1988 111
- Petersen K. Barth P. Poydock J. Brown J. Mallon, J. Jr Bryzek J. IEEE Solid State Sensors and Actuator Workshop Hilton Head, SC June 1988 144
- Wallis J. Pomerantz D. I. “Field-Assisted Glass-Metal Sealing” J. Appl. Phys. 40 3946 1969
- Pourahmadi F. Twerdok J. “Modelling Micromachined Elements with Finite Elements” Machine Design 44 1990
- Bassous E. Baran E. F. “The Fabrication of High Precision Nozzles by the Anisotropic Etching of (100) Silicon” J. Electrochem. Soc. 125 1321 1978
- Kurth R. H. “Process for Producing Uniform Nozzle Orifices in Silicon Wafers” September 25 1979
- Choi I. H. Wise K. D. “A Silicon-Thermopile-Based Infrared Sensing Array for Use in Automated Manufacturing” IEEE Trans. Electron Devices ED-33 72 1986
- Bryzek J. “New Generation of Disposable Blood Pressure Sensors” Sensors Expo Proceedings 1987
- Giachino J. M. Haeberle R. J. Crow J. W. “Method for Manufacturing Variable Capacitance Pressure Transducers” June 7 1983
- Hocker G. B. Johnson R. J. Higashi R. E. Bohrer P. J. “A Microtransducer for Air Flow and Differential Pressure Sensing Applications” Micromachining and Micropackaging Transducers Elsevier Science Publishers 1985
- Stephan C. H. Zanini M. “A Micromachined Mass-Air-Flow Sensor” 6th Int. Conference on Solid-State Sensors and Actuators San Francisco 1991
- Rudolf F. “Silicon Microaccelerometer” Transducers '87
- Roylance L. M. Angell J. B. IEEE TRans. Elect. Dev. ED-26 1911 1979
- Barth P. Pourahmadi F. Mayer R. Poydock J. Petersen K. IEEE Solid State Sensors and Actuator Workshop Hilton Head, SC June 1988 35
- Cole J. C. “A New Capacitive Technology for Low Cost Accelerometers” Sensors Expo 1989
- Howe R. T. “Surface Micromachining for Microsensors and Microactuators” J. Vac. Sci. Technol. B6 1809 1988
- Payne R.S. Dinsmore K. A. “Surface Micromachined Accelerometer: A Technology Update” SAE No. 910496