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Adhesion and Surface Chemistry of Sheet Molding Compound
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Abstract
The surface chemistry of styrene-crosslinked polyester sheet molding compound (SMC) and its interface with epoxy adhesives was investigated. A readily extractable thermoplastic material in the SMC contributed to the formation of weak boundary layers which could lead to near-interface failures and allow the growth of bubbles in the curing adhesive near the interface. The distribution of components in near-interface failure specimens was determined using FTIR and ESCA. A mathematical model of pore penetration by a curing liquid was developed to investigate dynamic wetting phenomena.
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Authors
- R.S. Farinato - American Cyanamid Co. Stamford, CT
- L.G. Magliocco - American Cyanamid Co. Stamford, CT
- J.S. Brinen - American Cyanamid Co. Stamford, CT
- S. Greenhouse - American Cyanamid Co. Stamford, CT
- J.P. Falzone - American Cyanamid Co. Stamford, CT
- S.S. Kaminski - American Cyanamid Co. Stamford, CT
- E.A. Kamenetzky - American Cyanamid Co. Stamford, CT
- L. Jackson - American Cyanamid Co. Stamford, CT
Citation
Farinato, R., Magliocco, L., Brinen, J., Greenhouse, S. et al., "Adhesion and Surface Chemistry of Sheet Molding Compound," SAE Technical Paper 910505, 1991, https://doi.org/10.4271/910505.Also In
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