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THE DEVELOPMENT OF ADVANCED COOLING METHODS FOR HIGH-POWER ELECTRONICS
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English
Abstract
Potential applications for high-power electronics in the aerospace industry are increasing at a rapid rate with the development of new switch technologies for high switching power. Inherent in these trends are rapidly increasing heat fluxes and severe difficulty in minimizing silicon operating temperatures to satisfy reliability requirements. Various new technologies are presented that have been developed to meet the difficult cooling requirements of high-density power electronics equipment for the aerospace industry. These enhanced cooling techniques have also been optimized to meet the maintainability requirements of future applications.
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Bland, T., Ciaccio, M., Downing, R., and Smith, W., "THE DEVELOPMENT OF ADVANCED COOLING METHODS FOR HIGH-POWER ELECTRONICS," SAE Technical Paper 901962, 1990, https://doi.org/10.4271/901962.Also In
References
- Bland T. J. et al. “A Compact High Intensity Cooler,” SAE Thirteenth Intersociety Conference on Environmental Systems July 1983
- Schrage D. “On the Use of a Small Scale Two-Phase Thermosiphon to Cool High Power Electronics,” AIAA/ASME Thermo-physics and Heat Transfer Conference June 1990
- BarCohen A. “Thermal Design of Immersion Cooling Modules for Electronic Components,” Journal of Heat Transfer Engineering Hemisphere Press July-December 1983