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Current Status and Future Trends of Electronic Packaging in Automotive Applications
ISSN: 0148-7191, e-ISSN: 2688-3627
Published October 01, 1990 by SAE International in United States
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Since the late 1970's the microcomputer has been introduced and rapidly expanded to various kinds of vehicle electronics applications. This technology has been utilized to provide automobiles which not only have higher performance but also run more smoothly and cleanly.
Microcomputer technology has also entered vehicle entertainment systems such as TV, mobile phone, VCR, and many other applications. Vehicle electronic packaging problems have developed as a result of this rapid expansion in vehicle microcomputer usage. Such problems include; size limitations, wire harness weight, wire harness complexity, connector size, electronic module packaging, and numerous other problems.
This paper provides historical packaging technology issues including system integration, hybrid IC module technology, and CAE reliability analysis for extreme conditions.
CitationMinorikawa, H. and Suda, S., "Current Status and Future Trends of Electronic Packaging in Automotive Applications," SAE Technical Paper 901134, 1990, https://doi.org/10.4271/901134.
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