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Excimer Laser Micromachining/Marking
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English
Abstract
The present generation of industrial ultraviolet light (UV) excimer lasers are being used in a growing number of demanding production and prototype application work that had previously been beyond the capabilities of such thermal sources as CO2, operating at 10.6 μm, or Nd:YAG and Nd:Glass, operating at 1.06 μm range. The high photon energy and the very short duration of the excimer pulses can efficiently initiate photochemical and/or photothermal surface reactions leading to precision micromachining, indelible marking, and microstructure modification.
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Citation
Scaggs, M., Sowada, U., and Andrellos, J., "Excimer Laser Micromachining/Marking," SAE Technical Paper 892257, 1989, https://doi.org/10.4271/892257.Also In
References
- Kahlert H.-J Sowada U. Basting D. SPIE Vol. 1023 Excimer Lasers and Applications Proceedings 1988 Hamburg, FRG Sept. 21-23 171
- Tsipas D. N. Floros T. SPIE Vol. 1023 Excimer Lasers and Applications Proceedings 1988 Hamburg, FRG Sept. 21-23 166 170
- Snowdon K. Rolt S. SPIE Vol. 1023 Excimer Lasers and Applications Proceedings 1988 Hamburg, FRG Sept. 21-23 158 165
- Wehner M. Poprawe R. Trasser F. SPIE Vol. 1023 Excimer Lasers and Applications Proceedings 1988 Hamburg, FRG Sept 21-23 179 186
- Scaggs M. Austin L. “The Niche For Excimer Lasers In Marking,” Industrial Laser Review Apr. 1988 8 9
- Scaggs M. Sowada U. “Excimer Lasers For Hybrid Circuit Materials Processing,” Hybrid Circuit Technology July 1989 23 27