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Electronic Packaging Needs Met by Three Dimensional Molded Interconnection Packages
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English
Abstract
Recent developments in plating and imaging of circuit patterns on three dimensional shapes have made it possible to apply electronic circuitry directly to the surface of a molded plastic part of complex configuration. Thus both mechanical and electrical functionality can be combined in a single low cost component. The paper reviews the state of the art of this Molded Interconnection Packaging Technology, describing advantages and limitations and offering examples of specific designs.