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Computer Modelling of Phenolic Postcure
ISSN: 0148-7191, e-ISSN: 2688-3627
Published February 01, 1987 by SAE International in United States
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Parts made from phenolic molding materials must be postcured to promote the thorough crosslinking required for end usage at temperatures above about 175°C. Since the time and energy used in postcuring can represent about ten percent of part cost, efficient postcuring offers significant potential savings.
Based on a kinetic description of the phenolic crosslinking reaction, we have developed a computer model to predict the development of the glass transition during postcure. This model provides a convenient CAD tool for minimizing postcuring costs.