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Automotive Electronic Reliability Prediction
ISSN: 0148-7191, e-ISSN: 2688-3627
Published February 01, 1987 by SAE International in United States
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The intent of this paper is to present updates to and further developments of the automotive electronic component reliability prediction models previously developed and summarized in SAE paper 840486. The relatively simplistic models presented previously have been further developed to account for factors such as temperature, decreasing failure rate with time, and nonoperating period failure rates. Models have been developed for microcircuits, diodes, transistors, capacitors, and resistors. These efforts are part of an on-going activity of the electronic reliability subcommittee of the SAE's electronics committee to analyze failure rate information on automotive electronic components and provide the automotive community with a means to predict electronic reliability.
CitationDenson, W. and Priore, M., "Automotive Electronic Reliability Prediction," SAE Technical Paper 870050, 1987, https://doi.org/10.4271/870050.
- Binroth, W. Coit, D. Denson, W. Hammer, K.M. “Development of Reliability Prediction Models for Electronic Components in Automotive Applications,” SAE Paper 840486
- Coit, D. Gossin, M. “Impact of Nonoperating Periods on Equipment Reliability,” Sept. 1984 RADC-TR-85-91
- Derr, J. “Reliability Prediction of Automotive Electronics - How Well Does MIL-HDBK-217D Stack-Up?” SAE Paper 850531