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Hybrid Circuit Assembly and Surface Mount Technology
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English
Abstract
Surface mount technology is the method of attaching leadless, short leaded or bare chips to various substrate materials. This technology is not new, but has caught on as a method of assembling printed circuit boards and is considered the wave of the future. This may be regarded as a marriage between conventional hybrid assembly and printed circuit boards as this technology has been recognized for over 30 years in the hybrid industry.
This paper will discuss the assembly methods and the merits of both of these technologies.
Topic
Citation
Danner, P., "Hybrid Circuit Assembly and Surface Mount Technology," SAE Technical Paper 851460, 1985, https://doi.org/10.4271/851460.Also In
References
- Amperex Mcrocomponents Catalog (A Phillips Company) No. 5608D
- Signetics Microminiature Packages Catalog No. 2000209A
- Surface Mount Technology in the Hybrid Microelectronics Industry Marvin Craft
- Surface Mount Technology ISHM Technical Monograph Series 6984-0002