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A Thermal Model for Audio Power Amplifiers
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English
Abstract
This paper develops a thermal model for analyzing transient and steady state heat flow in power amplifier heat sinks. This model is used to predict I.C. junction and heat sink temperatures, power output, and power dissipation over any time interval. Methods of determining heat sink parameters are discussed followed by a comparison of measured versus calculated data on a two channel power amplifier.
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Citation
Southworth, T., "A Thermal Model for Audio Power Amplifiers," SAE Technical Paper 840163, 1984, https://doi.org/10.4271/840163.Also In
References
- “Audio/Radio Handbook,” National Semiconductor 1980
- “Linear/Switch Mode Voltage Regulator Handbook,” Motorola, Inc. 1982
- Manchester Kenneth E. “Thermal Resistance - A Reliability Consideration,” Sprague Electric Company Technical Paper 1980
- Holman J. P. “Heat Transfer,” fourth edition McGraw-Hill, Inc. 1976