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Thermal Characteristics of Standardized Air Force Avionic Enclosures
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English
Abstract
A series of thermal analyses and tests have been conducted on several avionic enclosures, or “black boxes”, with the enclosure designs being representative of those covered under a new Air Force standard. As a part of this effort, the thermal characteristics of various state-of-the-art hardware elements were investigated, including their effect on overall enclosure thermal performance. Using this data, analyses and tests were then carried out on complete enclosures, with the results indicating that power levels up to 1 watt/in3 could be achieved without exceeding device junction temperature limits.
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Citation
Franklin, J. and Leonard, C., "Thermal Characteristics of Standardized Air Force Avionic Enclosures," SAE Technical Paper 831103, 1983, https://doi.org/10.4271/831103.Also In
References
- Development of Avionics Installation Interface Standards, ARINC Research Publication 2258-213-2595 ARINC Research Corporation Annapolis, MD December 1981
- Technical Investigation of Standard Air Force Avionic Enclosures, Final Report, Boeing Document No. D-180-27340-1 December 1982
- Air Transport Avionics Equipment Interfaces, ARINC Specification 600-1 Aeronautical Radio, Inc. August 1978
- Thermal Contact Conductance of Six Printed Circuit Board Thermal Connector Designs, Boeing Document No. D-180-24870-1 November 1978
- Heat Pipe Thermal Control For Modular Avionics Packaging - Final Report, Contract No. N00163-7S-C-0331 Naval Avionics Center Indianapolis, Indiana May 1979