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Worldwide Status of Leadless Component Assembly Technology
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English
Abstract
The wide variety of available leadless electronic components is described. Some typical applications of these devices are illustrated. The advantages to be gained through the use of these surface mounted devices are explained. These include reduced size, increased reliability, improved performance and reduced cost. Methods of application, including automatic assembly equipment, are discussed. Several applicable soldering processes are explained.
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Authors
Citation
Moe, R. and Colten, R., "Worldwide Status of Leadless Component Assembly Technology," SAE Technical Paper 820916, 1982, https://doi.org/10.4271/820916.Also In
References
- Winkler E. R. “Integrated Circuit Packaging Trends,” Solid State Technology June 1982
- Mokhoff Nicolas “Trends in Solid State Technology,” Circuits Manufacturing 1982
- Crawford Bill Gorin Jeff “Modular Intelligent Systems,” October 14 1982
- Goelz Ernest O. “Hybrid Microelectronic Assembly--A New Age of Sophistication.” International Journal for Hybrid Microelectronics October 1981
- Thackray Ian “Using Chip Carriers,” Semiconductor Production February 1982