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Determination of Stress by Means of Copper Electroplating
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English
Abstract
In order to find out the stress imposed on machine part, strain gages are very accurate, but it is difficult to find out the distribution. Photoelasticity, stress coat etc. is adapted for this purpose, but the accuracy is insufficient.
We have developed a new method to find out the stress and its distribution accurately, especially for repeated stress.
When cyclic load is applied to the specimen plated with copper, grain-growth is started in the copper deposit resulting in the flecks on the surface. Number and size of grain are proportional to the magnitude of the stress applied. As the relation of stress and grain size are determined by the standard sample, the stress magnitude of any specimen can be measured by comparing the grain size after undergoing cyclic stress.
Therefore this is a good method to determine the fatigue life.
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Authors
Citation
Aoki, K. and Hirobe, Y., "Determination of Stress by Means of Copper Electroplating," SAE Technical Paper 820782, 1982, https://doi.org/10.4271/820782.Also In
References
- Seika S. “Measurement of the Stress by Means of Electroplating” The Journal of The Marine Engineering Society in Japan 11 13 November 1978
- Okubo H. “Determination of the Surface Stress by Means of Electroplating J. App. Phys. 24 1953 1130
- Okubo H. Sato S. “Stress - Concentration Factors in Shaft With Transverse Holes as Found by the Electroplating Method” J. App. Mech, Trans. ASME 22 1955 193
- Suzuki M. “Determination of the Distribution of Maximum Shearing Stress on Metal Surfaces by Means of Electroplating Method” Proc. 6th Japan National Congress for App. Mech. 1956 103
- Okubo H. Nozaki N. “Grain-Growth in Metals by Cyclic Stress Nature 180 September 1957 604
- Okubo H. Hosono K. Sakai K. “The Stress Concentration in Keyways when Torque is Transmitted through Keys” Experimental Mechanics August 1968 375