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Reliability Characteristics of Various Microcircuit Technologies
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English
Abstract
This paper presents an analysis of microcircuit reliability data residing in the Reliability Analysis Center (RAC) data bank. Included in this study are SSI, MSI and LSI digital, linear and hybrid microcircuits.
Failure rate data are presented for all technologies for both test and operational conditions. Failure mode data are presented for TTL, CMOS and hybrid microcircuits. Effects of package configuration, device complexity and test conditions are reviewed.
In summary, this paper provides an overview of microcircuit reliability characteristics as derived from a broadly based ongoing data accumulation effort. These data are offered to users as published reports and as indirect response to specific inquiries.
Citation
Klein, M. and Lauffenburger, H., "Reliability Characteristics of Various Microcircuit Technologies," SAE Technical Paper 770227, 1977, https://doi.org/10.4271/770227.Also In
References
- Military Publication Test Methods and Procedures for Microelectronics
- Military Publication Reliability Prediction of Electronic Equipment
- “Microcircuit Device Reliability: Digital Detailed Data” RAC Publication Autumn 1976
- “Microcircuit Device Reliability: Memory/LSI Data RAC Publication Winter 75 76
- “Microcircuit Device Reliability: Hybrid Circuit Data” RAC Publication Autumn 1976