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The Use of Cobalt in Plated Copper to Inhibit the Formation of Brittle Copper-Tin Intermetallic Compounds - at the Copper-Solder Interface on Printed Circuit Boards

Technical Paper
ISSN: 0148-7191, e-ISSN: 2688-3627
Published February 01, 1971 by SAE International in United States
Annotation ability available
Language: English