This content is not included in your SAE MOBILUS subscription, or you are not logged in.
Thermal Cycle Effects on MIB Reliability
ISSN: 0148-7191, e-ISSN: 2688-3627
Published February 01, 1970 by SAE International in United States
Annotation ability available
In an effort to further the understanding of the physics of MIB failure extensive tests were conducted to determine the effects of MIB-PTH reliability of:
long-term thermal cycle environments
selected MIB design parameters, and
selected MIB processing parameters.
This paper presents the most significant results of these tests.
Each of the eighteen MIB's tested contained approximately 1,300 PTH's divided evenly among thirty-four circuits. Three thermal cycle environments were selected for testing with each of these environments being within severe but realistic military use conditions. Test acceleration was achieved by a new experimental concept termed “enhanced defect” testing. With careful choice of test article design and manufacture, failure mechanisms which occur only rarely in a normal product sample may be observed and analyzed in large numbers, in a controlled defect-enhancement sample.
Implementation of the enhanced-defect concept on the eighteen test MIB's resulted in six MIB types differing in the degree and type of defect enhancement. Some MIB's were manufactured with excessive amounts of “epoxy-smear”, others were purposely poorly laminated and still other MIB's were produced with thin hole plate, irregular hole plate or brittle hole plate to determine how these variables affected the PTH failure processes. Finally, a number of MIB's were manufactured with optimum characteristics to serve as experimental control samples.
Circuit resistance measurements were periodically made throughout environmental exposure on all test MIB's. Microscopic examinations were performed on hundreds of PTH's during and at test completion. Point-to-point continuity profiles of numerous test circuits were completed after environmental test. The data acquired during the 60-million PTH-hours of testing, the 10,000 electrical measurements, the numerous microsections and the hundreds of circuit continuity profiles were analyzed in depth to determine the effects of the programmed design and processing parameters on MIB reliability.
CitationHurley, H., "Thermal Cycle Effects on MIB Reliability," SAE Technical Paper 700649, 1970, https://doi.org/10.4271/700649.
- Easterday, J. L. et al “Industrial Survey of Electronic Packaging” November 1966
- Moore-Peterson Associates “Survey/Study of the Interconnection Problem in Microelectronics” NASA CR-414 March 1966
- Bryant, R. D. et al “Reliability of Microelectronics Circuit Connections” September 1967
- Raymond, G. A. “Second Thought on Reliability” International Aerospace Conference Phoenix, Arizona April 1964
- Young, M. A. “Pre-Delivery Steps Toward Reliable Computers” Annals of Reliability and Maintainability 4 229 239 Spartan Books Washington, D.C. 1965
- Wild, R. N. “Mechanical Properties of/and Thermal Effects on G-10 Multilayer Interconnection Boards” IBM Report Number 69-824-2367
- Hurley, H. C. Briggs, L. F. Pilling, M. E. et al “Reliability Investigation of Multilayer Interconnection Boards (MIB's)” Final Technical Report February 1969
- McFarland, F. J. Schnorr, D. P. “Predicting Multilayer Reliability” Electronic Packaging and Production 112 December 1968
- Schlaback Rider Printed and Integrated Circuitry McGraw Hill 420 1963