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Semiconductor: Wire Bonding and Face Bonding Considerations and Comparisons
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English
Abstract
Begins with a review of semiconductor wire bonding techniques utilizing both thermocompression and ultrasonic methods. Next, disadvantages of using interconnect leadwires are covered. Finally, a description of leadless face bonding is included with emphasis on the important functions in state-of-the-art techniques as well as on simplicity, accuracy and repeatability.
Citation
Koshinz, E., "Semiconductor: Wire Bonding and Face Bonding Considerations and Comparisons," SAE Technical Paper 680803, 1968, https://doi.org/10.4271/680803.Also In
References
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