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Laser Welding of Microcircuit Interconnections - Simultaneous Multiple Bonds of Aluminum to Kovar
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English
Abstract
The development of a laser welder to produce multiple welds/laser pulse for use in a flip-chip process is described. Using a glass laser with a blocking mask to split the laser beam into a multiplicity of spots, the simultaneous welding of all 14 interconnect points between an aluminum interconnect pattern on a glass substrate and an unplated Kovar lead frame is possible, weld shear strength of from 800 – 1200 grams in eight-spot samples was achieved in an experimental system.
Citation
Battista, A. and Ponti, M., "Laser Welding of Microcircuit Interconnections - Simultaneous Multiple Bonds of Aluminum to Kovar," SAE Technical Paper 680802, 1968, https://doi.org/10.4271/680802.Also In
References
- Bouchard J.G. Ponti, M.A. Sr. “Flip-Chip Bonding and Dimensional Transformation - A Low-Cost Microcircuit Production Technique,” (Sprague Technical paper No. TP-67–l6) presented at Sixth Annual Microelectronic Symposium St. Louis Section I.E.E.E. June 1967
- Cohen, M. I. “Laser Beams and integrated Circuits,” Bell Laboratories Record Vol. 45 Number 8 September 1967
- Anderson J. E. Jackson, J. E. “An Evaluation of Pulsed Laser Welding,” Laser Welding and Machining 1966 4 25
- Adams, C. M. Jr. “Laser Welding Studies,” The Welding journal Research Supplement 1965