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Thermal Stress Analysis of Epoxy Encapsulants
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English
Abstract
The stresses produced by the epoxy resin during thermal shock may cause rupture of the component-to-ribbon welds in encapsulated welded modules. This investigation develops a mathematical model describing the stresses on component lead wires. Stresses are functions of the temperature-dependent mechanical properties of the epoxy, diameter of an epoxy slug in shear with the component lead wire, and temperature. Thermal stress indexes were established to predict the thermal-shock properties of epoxies. Strain-gage force-voltage transducers, simulating epoxy-encapsulated, cylindrical, electronic components, were used to measure stresses in modules. Good agreement was obtained between experimental data and theoretical results.
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Authors
Citation
Nikolaychik, G., "Thermal Stress Analysis of Epoxy Encapsulants," SAE Technical Paper 670219, 1967, https://doi.org/10.4271/670219.Also In
References
- Swanson F. D. “The Use of Conformal Coatings to Relieve Encapsulation Stresses.” Insulation February 1966
- Johnson L. I. Ryan R. J. “Encapsulated Component Stress Testing.” Sixth Electrical Insulation Conference September 1965
- Geshner R. A. “Welded Electrical Joints and Criteria for Progress Acceptance.” National Electrical Packaging and Production Conference New York 1963
- Bush A. J. “Measurement of Stresses in Cast Resins.” Plastics February 1958
- King A. L. “Thermophysics.” San Francisco W. H. Freeman and Company 1962
- Wenger L. S. Knapp W. J. “Prestressing and Thermal Shock of Ceramics.” Pacific Coast Ceramic News February 1955