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A New Approach to Parallel-Gap Joining
ISSN: 0148-7191, e-ISSN: 2688-3627
Published February 01, 1967 by SAE International in United States
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One of the major problems in conventional parallel-gap joining methods is overheating. Damage to the copper circuit thus results. The BWRA has designed a new electrode with a metallic insert. The insert which is separated from the electrodes by a thin dielectric acts as a heat sink. Joints made with the new electrode have a large bond area, show little damage to the substrate, and exhibit a characteristic fillet at the edge of the lead. This fillet is a visual indication of a satisfactory joint.