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Weld Stress Evaluation — Electronic Modules
ISSN: 0148-7191, e-ISSN: 2688-3627
Published February 01, 1965 by SAE International in United States
Annotation ability available
Welded joints of electronic modules are adversely stressed by some encapsulants, especially when subjected to temperature cycling. Weld joints of specific tensile strengths were developed, encapsulated with various resins, and temperature-cycled to determine failure caused by internal stress. Resins with high coefficients of thermal expansion and high shrinkage values caused weld failures after cure. Furthermore, stress reduction can be accomplished by proper spacing of weld interconnects.