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Aerospace & Defense Technology: December 2021

  • Magazine Issue
  • 21AERP12
Published December 01, 2021 by SAE International in United States
Sector:
Language:
  • English
  • Designing, Developing and Deploying CubeSats
  • Testing EMI Materials for Battlefield Applications
  • Finding the Perfect Aluminum for Additive Manufacturing
  • Low Distortion Titanium in Laser Powder Bed Fusion Systems
  • Monitor Your Spectrum for Signs of Threats
  • JADC2: Building the U.S. Military's Internet of Things
  • Cylindrical Array Radar: Comparison to Multi-Faced Systems for Horizon Surveillance and Application to Ubiquitous Radar
    Cylindrical phased arrays are an attractive aperture for radar applications due to their steering-angle independent gain, beamwidth, polarization, sidelobe levels, and reflection coefficient, as well as the ease with which they form omnidirectional and wide-sector-covering transmit beams.
  • Fatigue Behavior of an Advanced Melt-Infiltrated SIC/SIC Composite with Environmental Barrier Coating at 1200°C in Air and in Steam
    Because of their low density, high strength and fracture toughness at high temperatures, SiC fiber- reinforced SiC matrix composites are being evaluated for aircraft engine hot-section components.
  • Bio-Based Polyurethane Containing Isosorbide for Use in Composites and Coatings
    Formulating polyurethane that can be used in composites or coatings containing isosorbide as part or all of the polyol phase and can be easily molded or cast into a film at ambient conditions.
  • Cold Sprayed Coatings with Dual Nanoparticle Reinforcements for Wear and Corrosion Protection
    As a form of additive manufacturing, the use of cold spray has made significant strides since differ-ent-sized particles were explored in the process. There is proof that micron-sized particles down to nanoparticles enhance the mechanical material properties of a substrate in wear resistance.
  • Novel Whisker Mitigating Composite Conformal Coat Assessment
    European Union RoHS compliant commercial lead-free electronics used in DoD electronics have an increased failure risk due to tin whisker short circuits unless properly mitigated by design.