This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
A Parametric Study on Electro Thermally Actuated Novel Compliant Microgripper
Technical Paper
2019-28-0032
ISSN: 0148-7191, e-ISSN: 2688-3627
This content contains downloadable datasets
Annotation ability available
Sector:
Language:
English
Abstract
At Micron-level actuation, thermal gripper provides greater forces when compared with electrostatic mode of actuation. To accomplish larger translations at minimal voltages, the Electro thermal actuation is applied. The mechanism of selective non-uniform Joule heating; which helps in thermal expansion of the design owing to restraints. The gripper proposed in this work is analyzed using FEA and is fabricated using Aluminum and stainless steel to achieve quicker response. The in-plane displacement, strain, stress, current density and temperature have been predicted for different magnitudes of current-voltage combination that the gripper sustains. It was found that, micro gripper performs well under 1v giving 60 μm displacement. Parametric sweep was carried out using commercially available FEA software package; COMSOL Multiphysics, to study and asses the outcome of various parameters on the performance of the gripper. It has been observed that the displacement increases with the increase in applied voltage.
Authors
Citation
Elsen, R., Bharadwaj, K., and Ramesh, T., "A Parametric Study on Electro Thermally Actuated Novel Compliant Microgripper," SAE Technical Paper 2019-28-0032, 2019, https://doi.org/10.4271/2019-28-0032.Data Sets - Support Documents
Title | Description | Download |
---|---|---|
Unnamed Dataset 1 | ||
Unnamed Dataset 2 |
Also In
References
- Keller , C.G. and Howe , R.T. Hexsil Tweezers for Teleoperated Microassembly Proceedings of the 10th Annual International Workshop on Microelectromechanical Systems (MEMS 97) Nagoya, Japan 26-30 January 1997 72 77
- Timoshenko , S.P. and Goodier , J.N. Theory of Elasticity 2nd New York McGraw-Hill 1951
- Benecke , W. and Riethmuller , W. Applications of Silicon Micro Actuators Based on Bimorph Structures Proceedings of the IEEE MEMS Workshop Salt Lake City, Utah February 1989 116 120
- Takeshima , N. and Fujita , H. Polyimide Bimorph Actuators for a Ciliary Motion System Micromechanical Sensors, Actuators, and Systems 203 209 1991
- Chu , W.H. and Mehregany , M. Micro Fabricated Tweezers with a Large Griping Force and a Large Range of Motion Proceedings of the Solid-State Sensors and Actuators Workshop Hilton Head Island, SC June 1994 107 100
- Sun , X.Q. , Gu , X. , and Carr , W.N. Lateral In-Plane Displacement Microactuators with Combined Thermal and Electrostatic Drive Proceedings of the Solid-State Sensors and Actuators Workshop Hilton Head Island, SC June 1996 152 155
- Guckel , H. , Klein , J. , Christenson , T. , Skrobis , K. , Laudon , M. , and Lovell , E.G. Thermomagnetic Metal Flexure Actuators Technical Digest of Solid-State Sensors and Actuators Workshop Hilton Head Island, SC 1992 73
- Comtois , J. and Bright , V. Surface Micromachined Polysilicon Thermal Actuator Arrays and Applications Proceedings of the Solid-State Sensor and Actuator Workshop Hilton Head Island, SC June 1996 174 177
- Lerch , P. , Slimane , C.K. , Romanowicz , B. , and Renuad , P. Modelization and Characterization of Asymmetrical Thermal Microactuators J. Micromech. Microeng. 6 134 137 1996