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Solder Void Modeling and Its Influence on Thermal Characteristics of MOSFETs in Automotive Electronics Module

Journal Article
2017-01-0011
ISSN: 1946-4614, e-ISSN: 1946-4622
Published March 28, 2017 by SAE International in United States
Solder Void Modeling and Its Influence on Thermal Characteristics of MOSFETs in Automotive Electronics Module
Sector:
Citation: Sridharan, K. and Viswanathan, S., "Solder Void Modeling and Its Influence on Thermal Characteristics of MOSFETs in Automotive Electronics Module," SAE Int. J. Passeng. Cars – Electron. Electr. Syst. 10(2):283-289, 2017, https://doi.org/10.4271/2017-01-0011.
Language: English

References

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  7. Katsis, D.C., and vanWyk, J.D., "A Thermal Mechanical and Electrical Study of Voiding in the Solder Die-Attach of Power MOSFETs, "IEEE Transactions on Components and Packaging Technologies, Volume: 29, Issue:1, March 2006; p.127-136.
  8. Liu Chen, Mervi Paulasto-Krockel, Ulrich Frohler, Dirk Schweitzer and Heinz Pape, "Thermal Impact of Radomly Distributed Solder Voids on Rth-JC of MOSFETs, "2nd Electronics System Integration Technology Conference IEEE;2008, p.237-243.

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