Try Mobilus Beta
Search tips
 This content is not included in your SAE MOBILUS subscription, or you are not logged in.

Solder Void Modeling and Its Influence on Thermal Characteristics of MOSFETs in Automotive Electronics Module

Journal Article
2017-01-0011
ISSN: 1946-4614, e-ISSN: 1946-4622
DOI: https://doi.org/10.4271/2017-01-0011
Published March 28, 2017 by SAE International in United States
Solder Void Modeling and Its Influence on Thermal Characteristics of MOSFETs in Automotive Electronics Module
Sector:
Citation: Sridharan, K. and Viswanathan, S., "Solder Void Modeling and Its Influence on Thermal Characteristics of MOSFETs in Automotive Electronics Module," SAE Int. J. Passeng. Cars – Electron. Electr. Syst. 10(2):283-289, 2017, https://doi.org/10.4271/2017-01-0011.
Language: English

References

  1. Chan , Y.C. , Xie , D.J. , and Lai , J.K.L Experimental Studies of Pore Formation in Surface Mount Solder Joints Mater. Sci. Eng. 1996 38 53 61
  2. Zeng , K. , and Tu , K.N. Six Cases of Reliability Study of Pb-Free Solder Joints in Electronics Packaging Mater. Sci. Eng. 2002 38 55 105
  3. Chang , J. , Wang , L. , Dirk , J. , and Xie , X. Finite Element Modeling Predicts the Effects of Voids on Thermal Shock Reliability and Thermal Resistance of Power Device Weld. J. 2006 85 63s 70s
  4. Fleischer Amy , S. , Chang Li-hsin , and Johnson Barry , C. The Effect of Die-Attach Voiding on the Thermal Resistance of Chip Level Packages Microelectron. Reliab. 2006 46 794 804
  5. Zhu , N. Thermal Impact of Solder Voids in the Electronics Packaging of Power Devices Semiconductor Thermal Measurement and Management Symposium, IEEE 2002 22 29
  6. Biswal Laxmidhar , Krishna Arvind and Sprunger Doug Effect of Solder Voids on Thermal Performance of High Power Electronic Module Electronics Packaging Technology Conference IEEE 2005 526 531
  7. Katsis , D.C. , and vanWyk , J.D. A Thermal Mechanical and Electrical Study of Voiding in the Solder Die-Attach of Power MOSFETs IEEE Transactions on Components and Packaging Technologies 29 1 March 2006 127 136
  8. Liu Chen , Mervi Paulasto-Krockel , Ulrich Frohler , Dirk Schweitzer and Heinz Pape Thermal Impact of Radomly Distributed Solder Voids on Rth-JC of MOSFETs 2nd Electronics System Integration Technology Conference IEEE 2008 237 243

Cited By

Recommended Content

Technical Paper Design Optimization of Sandwich Composite Armors for Blast Mitigation Using Bayesian Optimization with Single and Multi-Fidelity Data
Technical Paper AC-link™ Converter Topology for Power-Dense AC and DC Applications
Technical Paper Digital Electrohydraulic Control for Constant-Deceleration Emergency Braking