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A New Platform to Study the Correlation between Aging and SEE Sensitivity for the Reliability of Deep SubMicron Electronics Devices
Technical Paper
2015-01-2556
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
The changes brought by the increasing integration density and the new technological trends have pushed the reliability at its limit. Safety analysis for critical system such as embedded electronics for avionics systems needs to take into account these changes. In this paper, we present the consequences on the deep sub-micron (DSM) CMOS devices concerning their single event effect (SEE) sensitivity. We also propose a new modeling method in order to address these issues.
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Rousselin, T., Hubert, G., Regis, D., and Gatti, M., "A New Platform to Study the Correlation between Aging and SEE Sensitivity for the Reliability of Deep SubMicron Electronics Devices," SAE Technical Paper 2015-01-2556, 2015, https://doi.org/10.4271/2015-01-2556.Also In
References
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