This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Transient Liquid Phase Sintering (TLPS) Conductive Adhesives for High Temperature Automotive Applications
Journal Article
2014-01-0797
ISSN: 1946-3979, e-ISSN: 1946-3987
Sector:
Topic:
Citation:
Pan, B. and Yeo, C., "Transient Liquid Phase Sintering (TLPS) Conductive Adhesives for High Temperature Automotive Applications," SAE Int. J. Mater. Manf. 7(2):320-327, 2014, https://doi.org/10.4271/2014-01-0797.
Language:
English
References
- Jurgen Ronald K. Automotive Electronics Handbook McGraw-Hill Professional 1999
- Myers , Bruce A. , Eesley , Gary and Ihms , David Electronics Cooling In The Automotive Environment Electronics Cooling 16 1 16 21 Spring 2010
- Narumanchi , S. , Mihalic , M. , Kelly , K. and Eesley , G. Thermal Interface Materials for Power Electronics Applications National Renewable Energy Laboratory (NREL) conference paper, NREL/CP-540-42972 July 2008
- Gallagher , Catherine , Matijaservic , Goran and Maguire , James Transient Liquid Phase Sintering Conductive Adhesives as Solder Replacement 47 th Electronic Components and Technology Conference (ECTC) San Jose, CA May 19 21 1997
- Gallagher , C. , Matijasevic , G. and Capote , M. A. Transient Liquid Phase Sintering Conductive Adhesives Proceedings Surface Mount International August 1995 568 573
- German , R. M. Liquid Phase Sintering Plenum Press 1985
- Lee , C. C. , Wang , C. Y. and Matijasevic G. A New Bonding Technology Using Gold and Tin Multilayer Composite Structures IEEE Transactions on Components, Hybrids and Manufacturing Technology 14 1991 407 412
- Jacobson D. M. and Humpston G. High Power Devices: Fabrication Technology and Developments Metals and Materials 7 1991 733 739
- Roman J. W. and Eagar T. W. Low Stress Die Attach by Low Temperature Transient Liquid Phase Bonding Proceedings of the International Symposium on Microelectronics ISHM Nov. 1992 52 57
- Wrosch , M. and Soriano , A. Sintered Conductive Adhesives for High Temperature Packaging The 60 th Electronic Components and Technology Conference (ECTC) Las Vegas June 2010
- Wang , P. J. , Kim , J. S. and Lee , C. C. A New Bonding technology Dealing with Large CTE Mismatch Between Large Si Chips and Cu Substrates 2008 Electronic Components and Technology Conference 1562 1568 2008
- Yoon , S. W. , Shiozaki , K. , Yasuda , S. and Glover M. D. Highly Reliable Nickel-Tin Transient Liquid Phase Bonding Technology for High Temperature Operational Power Electronics in Electrified Vehicles Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition 478 482 Orlando, Florida February 5 9 2012
Cited By
Recommended Content
Technical Paper | Electrocoating of Car Radiators - A Way to Improve Corrosion Resistance |
Technical Paper | Corrosion of Lead-Tin and Lead-Free Solders in Engine Coolants |
Ground Vehicle Standard | Laboratory Testing of Vehicle and Industrial Heat Exchangers for Thermal Cycle Durability |