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Active Heat Sink for Automotive Electronics

Journal Article
2009-01-0965
ISSN: 1946-4614, e-ISSN: 1946-4622
DOI: https://doi.org/10.4271/2009-01-0965
Published April 20, 2009 by SAE International in United States
Active Heat Sink for Automotive Electronics
Sector:
Citation: Vetrovec, J., "Active Heat Sink for Automotive Electronics," SAE Int. J. Passeng. Cars – Electron. Electr. Syst. 2(1):336-343, 2009, https://doi.org/10.4271/2009-01-0965.
Language: English

References

  1. Simpson, C. “Liquid cooling for wide bandgap semiconductor technology,” presentetd at Adv. Liquid Cooling Workshop May 13 2003
  2. Harper, Charles A. “Electronic Packaging and Interconnection Handbook,” 4th ed. McGraw-Hill 2005
  3. Steinberg, Dave S. “Cooling Techniques for Electronic Equipment,” 2nd Ed. John Wiley & Sons, Inc. New York 1991
  4. Vetrovec, J. US Patent Application 2007
  5. Geratherm Medical AG www.geratherm.com
  6. Vetrovec, J. “High-Performance Heat Sink for Solid-State Lighting,” SPIE paper no. 7231-25 presented at the LASE ’2009 Conference in San Jose, CA January 2009
  7. Vetrovec, J. “Quasi-Passive Heat Sink for High-Power Laser Diodes,” SPIE paper no. 7198-12 presented at the LASE ’2009 Conference in San Jose, CA January 2009

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