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Super-slim 2 Axes Automotive Accelerometer Using MEMS Technology
Technical Paper
2009-01-0636
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
We have developed a novel wafer process for capacitive sensing accelerometer using surface Micro Electrical Mechanical Systems (MEMS) technology and successfully applied to the fabrication process. Our new process combines with a single crystal SOI (Si on Insulator) wafer, high aspect ratio silicon etching and newly developed anhydrous HF/Alcohol etch process of silicon oxides. Although wet conditions such as HF/water etch occurs stiction of mobile structure, our anhydrous HF/Alcohol etch process technology occurs no stiction of mobile structures, because of gas phase (dry) process. In our process, we have achieved smaller-sized sensor chip compared to our conventional 2 axes accelerometer.
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Citation
Yokoyama, K., Furuichi, T., and Yokura, H., "Super-slim 2 Axes Automotive Accelerometer Using MEMS Technology," SAE Technical Paper 2009-01-0636, 2009, https://doi.org/10.4271/2009-01-0636.Also In
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