This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Analysis of Degradation Mechanism of Lead-Free Materials
Technical Paper
2009-01-0260
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Language:
English
Abstract
The use of lead-free (Pb-free) solder and plating in onboard electronic components has accelerated rapidly in recent years, but solutions have yet to be found for the issues of whisker generation in tin (Sn) plating and crack initiation in Pb-free solder, despite widespread research efforts. Analysis of the whisker generation mechanism has focused on internal energy levels and crystal orientation, and analysis of the crack initiation mechanism in Pb-free solder has examined changes in the grain boundaries of Sn crystals.
Recommended Content
Authors
Citation
Nomura, T., Shibata, Y., Sakano, M., and Konda, S., "Analysis of Degradation Mechanism of Lead-Free Materials," SAE Technical Paper 2009-01-0260, 2009, https://doi.org/10.4271/2009-01-0260.Also In
References
- Cobb, H. L. Monthly Review of American Electroplaters’ Society 33 No. 28 1946
- Compton, K. G. Mendizza, Arnold Corrosion 7 327 1951
- Tu, K. N. Li, J. C. M. Material Science & Engineering A409 131 2005
- Lee, B. Z. Acta Materialia 46 3701 1998
- Endo, M. 23rd ISTFA 305 1997
- Tanaka, Y. Yoshitomi, M. Ishiguro, Y. 12 th Symposium on “Microjoining and Assembly Technology in Electronics” 15 2006
- Nishiyama, T. Kohketsu, H. Takahashi, K. et al. Journal of Japan Institute of Electronics Packaging 9 162 2006
- Lin, C. H. Chen, Wang J. Elec. Mater 31 907 2002
- Shibata, Y. Nomura, T. et al. Transactions of Society of Automotive Engineers of Japan 39 2 341 2008
- Tsuji, K. Proc. IPC/JEDEC 10 th International Conference on Lead Free Electronic Components and Assemblies 11 2003