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Direct Bonding of a Multi-Layer Circuit Substrate to a Heatsink
Technical Paper
2007-01-4220
ISSN: 0148-7191, e-ISSN: 2688-3627
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English
Abstract
Phoenix International, the electronics manufacturing group of John Deere, has developed a product and manufacturing process to address many of the shortcomings of conventional heatsinking technologies. In this process, a thin circuit board is bonded directly to a flat surface heatsink such as a finned extrusion or liquid-cooled plate. The major benefits of the proposed solution are the simplification of the manufacturing process and substantially improved conduction of heat away from high-power circuitry.
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Citation
Godbold, C. and Tolstedt, J., "Direct Bonding of a Multi-Layer Circuit Substrate to a Heatsink," SAE Technical Paper 2007-01-4220, 2007, https://doi.org/10.4271/2007-01-4220.Also In
References
- “Electronic controller unit and method of manufacturing same” Formwalt et al Deere & Company
- Godbold, C. V. Sankara, V. A. Hudgins, J. L. “Thermal Analysis of High-Power Modules” IEEE Transactions on Power Electronics 12 1 Jan 1997
- Godbold, C. V. Sankara, V. A. Hudgins, J. L. “Novel Designs in Power Modules” Conference Record of the 1995 IEEE Industry Applications Conference 1 Oct 1995